High-Density Interconnect PCB
HDI PCB (High-Density Interconnect Printed Circuit Board) is a PCB that achieves higher circuit density by using thinner lines, smaller apertures and denser wiring design. This PCB technology can achieve more circuit connections in a limited space by adopting more advanced manufacturing processes and design technologies, and is widely used in mobile phones, tablets, computers, equipment, automobiles, electronics and other medical fields.
Advantages of Miniaturization design PCB:
- Miniaturization design
- Higher circuit density
- Better electrical performance
- Improve heat dissipation performance
- Reliability
Product Features:
1.High Interconnect Density:Achieves fine-pitch wiring via microvias (diameter <150 μm), blind/buried vias, and stacked structures, enabling more connections per unit area.
2.Ultrafine Feature Sizes:Supports trace widths/spacings ≤50 μm using advanced lithography (e.g., LDI), essential for miniaturized devices like smartphones.
3.Multilayer Complexity:Often involves 8+ layers with sequential lamination, allowing for any-layer interconnects (Any Layer HDI) but increasing alignment challenges.
4.Advanced Material Use:Employs thin cores (<100 μm), low-CTE substrates (e.g., modified epoxy), and low-Dk dielectrics to enhance signal integrity and thermal stability.
5.Enhanced Performance:Reduces signal loss, EMI, and latency with shorter electrical paths, improving high-frequency operation (e.g., 5G applications).
Manufacturing process:
- Microvia technology: One of the key technologies of HDI PCB is microvia technology, which uses laser or mechanical drilling to create tiny holes (gener less than 0.2mm) on the circuit board, and these microvias are used to achieve connections between layers.
- Multilayer wiring: HDI PCBs typically employ a multilayer design, connecting different circuit layers through blind and buried vias. Interconnection each layer is achieved through microvias, blind vias, or buried vias, which enhances the density and integration of the circuit board.
- Blind and buried via design: Blind vias are holes that connect only the outer and inner layers, while buried vias are holes that connect the inner layers. The use of these holes can further reduce the volume of the circuit board and increase the wiring density.
- Surface treatment and assembly: The surface treatment of HDI PCBs requires higher precision and reliability. Common surface treatments include gold plating, silver pl, OSP (Organic Metal Surface Treatment), etc. In addition, the assembly process of HDI PCBs usually requires fine welding technology to ensure the close connection between and the circuit board.
- High-precision process: In the manufacturing process of HDI PCB, high-precision etching technology is required to ensure the correct manufacturing of fine lines precision holes. At the same time, it is necessary to precisely control variables such as current density, temperature, and pressure to ensure the consistency and high performance.
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1.2mm Thinkness High Density Interconnect PCB Green Oil Miniaturization Design Images
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