4-layer HDI flexible PCB
Product Description:
4-layer HDI flexible PCB is a PCB that achieves higher circuit density by using thinner lines, smaller apertures and denser wiring design. This PCB technology can achieve more circuit connections in a limited space by adopting more advanced manufacturing processes and design technologies, and is widely used in mobile phones, tablets, computers, equipment, automobiles, electronics and other medical fields.
Product Features:
- High-density interconnection
- Micro via
- Blind and buried hole design
- Multi-level design
- Fine lines and fine pitch
- Excellent electrical performance
- Highly integrated
The main manufacturing challenges of HDI circuit boards
- Microvia processing requires laser drilling and precise plating to ensure reliable connections
- Multilayer registration demands micron-level alignment accuracy
- Fine line fabrication needs special processes to create lines as narrow as 0.076mm
- Signal integrity must be maintained through careful design and simulation
- Quality inspection relies heavily on X-ray and automated optical equipment
Advantages of High-Density Interconnect (HDI) Flexible Printed Circuit Boards (FPC):
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Miniaturization and Lightweight:
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HDI technology utilizes microvias, finer lines and spaces, and higher wiring density, significantly reducing the board size and layer count, enabling higher component density.
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Flexible materials inherently contribute to a lightweight design, essential for compact electronic devices.
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Superior Electrical Performance:
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Features shorter signal paths which minimize signal loss, crosstalk, and delays, thereby improving signal integrity for high-speed and high-frequency applications.
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Microvias have lower parasitic capacitance and inductance, contributing to better signal quality.
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High Reliability and Durability:
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The flexible nature allows the circuits to withstand bending, vibration, and shock, enhancing reliability in dynamic or harsh operating environments.
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The structure and smaller aspect ratio of microvias also contribute to increased board reliability.
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Space Utilization and 3D Design:
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FPCs can be bent and folded to conform to irregular product shapes or fit into confined spaces, facilitating three-dimensional interconnections.
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They can replace multiple connectors and wire harnesses, simplifying assembly and improving overall reliability.
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Long-Term Cost-Effectiveness:
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While initial manufacturing costs may be higher, the ability to reduce the number of layers, simplify assembly (by eliminating connectors/cables), and enhance overall product reliability leads to significant long-term system cost savings.
FAQ of HDI PCB
Q: What is the brand name of this product?
A: The brand name of this product is High Density Interconnect Flexible PCB.
Q: Where is this product manufactured?
A: This product is manufactured in China.
Q: What is the delivery time for this product?
A: The delivery time of the products varies according to the complexity of PCB manufacturing process.
Q: What are the payment terms for purchasing this product?
A: The payment terms for this product are T/T.
Q: What is the supply ability of this product?
A: The supply ability of this product is 3000㎡.
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4 Layer High Density Interconnect Flexible PCB Miniaturization Design Customized Images
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