FR4 OSP Surface Multilayer Printed Circuit Board 4 Layer PCB Board OEM/ODM Service

FR4 OSP 4-layer board PCB

Product Description:

FR4 OSP 4-layer board PCB Multilayer PCB is a printed circuit board composed of three or more layers of circuits. Each layer of circuits is composed of different circuit layers, and these layers are connected together through vias or interconnecting lines. Compared with single-sided and double-sided PCBs, multi-layer PCBs can achieve more circuit wiring in a smaller space and are suitable for more complex and function-intensive circuit designs.

Advantages of Multilayer PCB:

Product Features:

• Multi-layer design
• Inner layer and outer layer
• through hole
• Copper layer
• Dielectric layer (dielectric material)

Manufacturing process:

• Design and layout: During the design phase, engineers use PCB design software to lay out and route multilayer circuit boards, determining the functions of each's circuit and the interconnection method between layers.
• Lamination: During the manufacturing process, multiple circuit layers are pressed together through a lamination process, with each layer separated by an insulating material. lamination process is typically carried out under high temperature and high pressure conditions.
• Drilling and electroplating: Through-hole connections between different layers of the circuit are formed by drilling technology, and then electroplating is carried out ensure the conductivity of the through-holes.
• Etching: On each layer of the circuit, use photolithography and etching techniques to form the circuit pattern, removing excess copper foil
• Assembly and welding: After the components are installed, they can be soldered and connected using surface-mount technology (SMT) or traditional through-hole technologyTHT).

OSP Surface Multilayer Printed Circuit Board

FR4 Material 4 Layer PCB Board

FR4 OSP Surface Multilayer Printed Circuit Board 4 Layer PCB Board OEM/ODM Service Images