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Dongguan Xingqiang Circuit Board Technology Co., Ltd.
Dongguan Xingqiang Circuit Board Technology Co., Ltd.
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Electronic Double Sided Rigid PCB Board Printed Circuit Board 1.2mm Thinkness

Dongguan Xingqiang Circuit Board Technology Co., Ltd.
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Electronic Double Sided Rigid PCB Board Printed Circuit Board 1.2mm Thinkness

Brand Name : xingqiang

Model Number : Varies by goods condition

Certification : ROHS, CE

Place of Origin : China

MOQ : Sample,1 pc(5 square meters)

Price : NA

Payment Terms : ,T/T,Western Union

Supply Ability : 3000

Delivery Time : 7-10 work days

Min. Solder Mask Clearance : 0.1mm

Pcba Standard : IPC-A-610E

Board Thinkness : 1.2mm

Minimum Line Space : 3mil (0.075mm)

Surface Finishing : HASL/OSP/ENIG

Materila : FR4

Product : Print Circuit Board

Board Size : Customized

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Double-sided carbon oil process

Double-sided PCB, also known as double-sided printed circuit board, is a printed circuit board (PCB) with two-sided circuit connections. In this kind of PCB, the electronic components and circuit layout can be arranged on both sides of the PCB respectively, and the electrical connection of the circuits on both sides is achieved through vias (Vias). This structure greatly increases the functional density of the circuit board, allowing it to implement more circuit connections in a relatively small area.



Application

1.Consumer Electronics

• Smartphones

• Computers

• TVs

• LCD display modules

• Audio devices

2. Automotive Electronics

• Vehicle control systems

• Infotainment systems

• Navigation systems

3. Medical Devices

• Heart monitors

• Ultrasound equipment

• CT scanners

4.Communication

• Equipment

• 5G base stations

• Servers Routers



The main challenges in double-sided PCB manufacturing

1. Interlayer Alignment Precision

  • Double-sided PCBs require precise alignment between the top and bottom layers to ensure the accuracy of via connections. Even minor misalignment can lead to open circuits or short circuits.
  • The manufacturing process, including lamination and drilling, is highly sensitive to temperature and pressure changes, which can easily affect the alignment of the two layers.

2. Solder Mask Coating Uniformity

  • Applying solder mask on both sides demands consistent thickness and coverage. Uneven coating may cause poor insulation or difficulty in soldering components later.
  • The curing process for the solder mask on both sides needs strict parameter control; improper curing can lead to peeling or cracking of the mask layer.

3. Double-Sided Assembly Complexity

  • During component mounting, the weight and heat of components on one side may affect the stability of the other side, increasing the risk of component displacement or solder joint failure.
  • Testing for double-sided PCBs is more complex than for single-sided ones, as it requires verifying the functionality of both layers and the integrity of interlayer vias, which raises testing costs and difficulty.


Manufacturing process:

  • Design and layout:Firstly, the PCB design is carried out through circuit design software, with wiring and component placement on both sides, and the position type of vias are planned at the same time.
  • Drilling and electroplating: Drilling is carried out according to the design requirements, and electroplating is performed after drilling to form a via the circuits on both sides.
  • Etching: Remove the excess copper foil to form the desired circuit pattern.
  • Assembly and welding: After the components are installed, welding treatment is carried out, which can be done using surface-mount technology (SMT) or through technology (THT).



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